Intel Unveils Core Ultra Series 3 at CES 2026

Intel has officially unveiled its Core Ultra Series 3 processors at CES 2026, signaling a major push to regain dominance in the semiconductor market. These new chips, previously codenamed Panther Lake, are designed to deliver exceptional performance, graphics, and battery life for mobile devices.

The launch is particularly significant because these are the first chips manufactured using Intel's 18A process. This technology has been a central focus of the company's recent strategy. Alongside consumer laptops, the silicon has been certified for embedded and industrial applications, including robotics and smart cities.

The Core Ultra Series 3 lineup includes several flagship models designed for high-end computing. The chips are available in Core Ultra 7 and Core Ultra 9 ranges, as well as Core X7 and Core X9 variants.

Key specifications for the new processors include:

• Graphics: 12 Xe graphics cores, an upgrade over the usual four.
• Processing Power: Almost all models feature 16 total cores and threads.
• AI Performance: Total NPU performance of 50 PTOPS for all models except two.

These specifications aim to compete directly with the most advanced offerings from competitors, leveraging the new manufacturing process to pack more power into a smaller footprint.

The defining characteristic of the Core Ultra Series 3 is its manufacturing process. The chips are built on 18A, which stands for 18 Angstroms (roughly equivalent to 1.8 nanometers). This measurement represents a significant reduction in transistor size, allowing for greater efficiency and power.

The 18A process was a cornerstone of former CEO Pat Gelsinger's plan to restore Intel's leadership in the chip industry. While the company reportedly faced challenges with low yields and high defect rates as recently as August 2025, the successful launch at CES 2026 marks a turning point. Intel claims these are the most advanced chips ever manufactured in the United States, putting them on the same level as TSMC's N2 process available in Taiwan.

The event also highlighted the transition in leadership at Intel. Lip Bu-Tan, the new CEO, took the stage to announce that the company is now ahead of schedule for ramping production on the 18A process. This update suggests a potential shift in the global semiconductor market, which has been dominated by Asian foundries in recent years.

Consumers can expect to see these chips in a wide variety of laptops soon. Major manufacturers set to release devices featuring the Core Ultra Series 3 include:

• HP
• Acer
• Lenovo
• Dell
• Samsung

The broad adoption by these OEMs indicates strong industry confidence in Intel's new technology.

The introduction of the Core Ultra Series 3 at CES 2026 represents a critical moment for Intel. By successfully deploying the 18A process, the company has not only improved its chip performance but also validated its long-term manufacturing strategy. With Lip Bu-Tan at the helm and production ramping up ahead of schedule, Intel appears poised to challenge the status quo in the global chip market.

As these processors begin to appear in consumer devices from major brands like HP and Dell later this year, the industry will be watching closely to see if this launch truly marks the beginning of an Intel comeback.